Lam Research and the economics of harder-to-build memory

· Members

LRCX$231.57▼ 26.7% (−$84.27)

Oct 22 close

Since published on Sep 9 at $315.84 · SPY ▲ 0.1% · Edge −26.8 pts

Sep 9Oct 22

The setup

The useful question for Lam Research is whether memory manufacturers can improve their competitive position without buying more sophisticated equipment. If moving to a cheaper production process requires new etch and deposition capabilities, equipment demand can recover before manufacturers commit to a broad expansion in wafer capacity. That distinction creates a potentially investable setup: technology conversion spending can have a different timetable from commodity supply expansion.

Watch it play outA process change can buy tools before any new capacity
Existing wafer capacityExpansion: on holdSame capacity, new processLamEtch and depositionequipment orders

Start with a memory maker's existing wafer capacity.

One choice: add output on the existing process. Manufacturers can stay cautious about that.

The other choice: change the process itself, to defend the cost position. Same capacity, converted.

A conversion needs new etch and deposition capability, so equipment demand can recover before capacity grows.

Two timetables: technology conversion spending can move before commodity supply expansion.

Lam's 2024 September-quarter presentation identified an aging NAND installed base and a shift toward more layers and new materials. That was an early technical roadmap, not a current inventory estimate. The January 28, 2026 earnings call now describes NAND conversion spending as an opportunity that could arrive faster than previously anticipated. The useful question has moved from whether a conversion cycle exists to how much of the remaining cycle investors are already paying for. Earlier roadmap, October 23, 2024, Lam-hosted January 28, 2026 call transcript

The conversion story was public 15 months before the call
  1. May 2024Packaging processesDeposition and etch for chip integration
  2. Jul 31, 2024Cryo 3.0 etchThird-generation cryogenic etch
  3. Oct 23, 2024NAND roadmapAging installed base, more layers
  4. Jan 28, 2026Earnings callConversions could come faster
  5. Jan 30, 2026Analysis dateClose $233.46

The thesis is conditional. If customers need lower cost per bit and better performance, and if Lam retains the relevant process positions, conversions could support sales without a return to indiscriminate industry expansion. Neither rising data traffic nor an impressive engineering presentation establishes what shareholders should pay.

Watch it play outTaller memory stacks need harder etching, not more factories
Layers of memory cellsMore layers, more bitsDeep, narrow etchYield sets the cost

NAND memory stacks cells in layers on a wafer.

To cut cost per bit, the stack grows taller: more layers on the same wafer.

Every extra layer makes the holes deeper and narrower, and they must be etched accurately through the whole stack.

Yield decides it: more theoretical bits with too many defects can wipe out the cost advantage.

What the market may be missing

Companies in this article

Keep reading

Members-only research

We've published in-depth research on LRCX

The thesis, the numbers behind it, and what would break it. Full access is $39 a month.

Read the full research